Ultra Low Temp Metallized CPP Film for Chips Packaging

Min Order Quantity	5ton / ton
Supply Ability	2500ton/month
Port	China
Delivery Lead Time	2 weeks after receiving the prepayment

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Shijiazhuang Dadao Packaging Materials Co.,Ltd
[China]

Address: NO 9 Changjiang Road,high technology industrial development zone,Hebei ,China Shijiazhuang Hebei

Product Details

Quick Information

ultra low temp metallized CPP film for chips packaging

Application :

It is widely used as the lining of the compound food package,such as biscuits,isntant noodles,chocolate,puffing food etc

Thickness

20,25,30,40 etc

Width : ≤2500 mm

Paper core ID: 3” 76mm,6” 152mm

Features:

1.Good adhesion ability between bare film and aluminum layer.
2.Excellent aluminum uniformity.
3.It has hot sealing property

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